DESIGN

PRINTING

DIE CUTTING

EDGE

GLUING

WAREHOUSE

Further Processing

Bonding

This process guarantees a more resistant packaging, available in:

WAVE

ABBREVIATION

INDICATIVE THICKNESS (*)

Micro

E

mm 1,70 +/-

Bassa

B

mm 3,10 +/-

Effe

F

mm 1,20 +/-

Enne

N

mm 0,9 +/-

Microtriplo Coperto/Scoperto

EB/BE

mm 4,70 +/-

Doppia Microonda

EE

mm 3,2 +/-

EF Coperta e Scoperta

EF/EFS

mm 2,6 +/-